ManufacturingDFM Reference

JLCPCB Design Rules and Capabilities: Complete Specification Guide

Your definitive reference for JLCPCB PCB manufacturing specifications. From trace widths to layer stackups, surface finishes to impedance control - every parameter you need for successful fabrication.

December 5, 2025-40 min read-Complete Reference

Quick Reference - Key Specifications

Min Trace/Space:5 mil (2L), 3.5 mil (4-6L)

Min Via:0.45mm dia, 0.2mm drill

Board Size:5x5mm to 400x500mm

Layers:1-20 layers supported

Thickness:0.4mm to 2.0mm

Copper:0.5oz, 1oz, 2oz

JLCPCB Design Rules Overview

Introduction: Why Design Rules Matter

Every PCB manufacturer has unique capabilities and limitations. JLCPCB, as one of the world's largest prototype PCB manufacturers, processes millions of orders annually - and has optimized their production lines for specific design parameters.

Understanding these design rules isn't just about avoiding rejections. It's about:

  • Maximizing yield: Designs within capabilities have fewer defects
  • Minimizing cost: Standard specs avoid “special process” fees
  • Faster turnaround: No back-and-forth for DFM fixes
  • Predictable quality: Know what to expect from production

This guide consolidates all JLCPCB specifications into one comprehensive reference. Bookmark it for your next design.

Specifications Change

JLCPCB regularly updates their capabilities. This guide reflects specifications as of late 2025. Always verify critical parameters on JLCPCB's official capabilities page before finalizing designs.

Trace Width & Spacing Specifications

Trace width and spacing (clearance) are the most fundamental design rules. They depend on your layer count and copper weight.

2-Layer Boards

Copper WeightMin Trace WidthMin SpacingNotes
1 oz5 mil (0.127mm)5 mil (0.127mm)Standard, no extra cost
2 oz8 mil (0.2mm)8 mil (0.2mm)Required for heavy copper

4-Layer Boards

LayerCopper WeightMin Trace/Space
All Layers1oz outer / 0.5oz inner4 mil (0.1mm)
Inner Layers2oz outer / 0.5oz inner4 mil (0.1mm)
Outer Layers2oz outer / 0.5oz inner8 mil (0.2mm)

6+ Layer Boards

Layer CountMin Trace/SpaceNotes
6 Layer3.5 mil (0.09mm)Tightest standard spec
8-20 Layer3.5 mil (0.09mm)Same as 6-layer
Ultra-fine (special)3 mil (0.076mm)Available for limited traces

Extra Charges

Using 3.0-3.5 mil trace/space on multilayer boards incurs extra fees: +20% for 4-8 layers, and +30% for 10+ layers.

Design Recommendations

  • Standard designs: Use 6 mil trace/space for 2-layer boards - leaves margin for manufacturing variation
  • High-density: 4 mil is achievable on 4-layer without extra cost
  • Always wider when possible: Thinner traces have lower yield and conductivity

Via Specifications

Via parameters vary significantly between 2-layer and multilayer boards due to different drilling technologies.

JLCPCB Via Specifications Diagram

Via Size Requirements

Parameter2-Layer4+ Layer
Min Via Pad Diameter0.6mm (24 mil)0.45mm (18 mil)
Min Drill Diameter0.3mm (12 mil)0.2mm (8 mil)
Via-to-Via Clearance0.254mm (10 mil)5 mil (0.127mm)
Hole Clearance0.25mm0.25mm

Annular Ring

The annular ring is the copper ring around a drilled hole. For reliable vias:

  • Minimum annular ring: 0.15mm (6 mil)
  • Recommended: 0.2mm (8 mil) or larger for better reliability
  • Formula: Annular Ring = (Pad Diameter - Drill Diameter) / 2

Via Types Supported

Through-Hole Vias

Standard support for all layer counts. Goes through entire board.

Via-in-Pad (POFV)

Free for 6-20 layer boards. Resin-filled and capped with copper.

Blind/Buried Vias

NOT supported in standard production. Through-holes only.

Aspect Ratio Consideration

Aspect ratio = Board Thickness / Drill Diameter. Higher ratios are harder to manufacture. For reliable plating, keep aspect ratio under 10:1.

Hole Sizes & Drilling

JLCPCB uses mechanical drilling for all hole types. Drill sizes increment by 0.05mm.

Drill Size Specifications

Hole TypeMinimumMaximumTolerance
PTH (Plated Through Hole)0.15mm6.3mm+/-0.08mm (typical)
NPTH (Non-Plated)0.5mm6.3mm+/-0.05mm
Metallized Slot0.65mm-+/-0.15mm
Non-Metallized Slot1.0mm-+/-0.15mm

Small Holes (<0.3mm)

Holes smaller than 0.3mm are classified as “small holes” and may incur additional processing requirements:

  • Higher aspect ratio challenges
  • More difficult plating
  • May require specific stackup configurations

Recommended Via Size for Most Designs

For standard 2-layer boards, use 0.8mm pad with 0.4mm drill. For 4-layer, 0.6mm pad with 0.3mm drill works well. These provide good reliability and avoid extra charges.

Layer Stackups (1-20 Layers)

JLCPCB supports PCBs from 1 to 20 layers. Odd layer counts (3, 5, etc.) are manufactured as the next even number.

Available Layer Counts

LayersStarting Price (5pcs)Special Features
1-2 Layer$2Standard hobby prototypes
4 Layer~$20 eng. feeMost common multilayer
6 Layer$2 (promo)Free ENIG, Free via-in-pad
8 Layer~$82Free via-in-pad (POFV)
10-20 Layer$137+Via-in-pad included

Standard Stackup Materials

  • 1-6 layers: Standard FR-4
  • 8+ layers: Sytech and Nanya materials
  • High-frequency: Rogers, PTFE (Teflon) available
  • Thermal: Aluminum core, Copper core options

Free Via-in-Pad for 6+ Layers

JLCPCB provides free resin-filled, copper-capped via-in-pad (POFV) for all 6-20 layer boards. This enables direct BGA fanout without extra cost.

Board Dimensions & Thickness

Board Size Limits

TypeMinimum SizeMaximum Size
Single Board5mm x 5mm400mm x 500mm
V-Cut Panel70mm x 70mm400mm x 400mm
PCB Assembly10mm x 10mm470mm x 500mm

Board Thickness Options

ThicknessPrice ImpactRestrictions
0.4mmExtra costENIG only, no panelization
0.6mmExtra costMax 100x100mm, no HASL
0.8mm - 1.6mmStandard ($2 starting)All finishes available
2.0mmStandardAll finishes available

Tolerance: +/-10% of finished board thickness.

Most common: 1.6mm is the industry standard and most cost-effective option.

Copper Weight Options

Copper weight (measured in oz/ft²) determines trace current capacity and affects design rules.

Copper WeightThicknessMin Trace/SpaceBest For
0.5 oz17.5 µm4 milInner layers (multilayer)
1 oz35 µm5 milMost designs (standard)
2 oz70 µm8 milHigh current, power

Note: 2oz copper requires wider traces because thicker copper is harder to etch precisely.

Surface Finish Options

Surface finish protects exposed copper pads and affects solderability, shelf life, and cost.

JLCPCB Surface Finish Comparison

Available Finishes

FinishCostProsCons
HASL (Lead)LowestDurable, easy solderingUneven surface, not RoHS
Lead-Free HASLLowRoHS compliant, durableUneven, higher solder temp
ENIGHigherFlat, fine-pitch, long shelfCost, black pad risk
OSPLowFlat, RoHS, cost-effectiveShort shelf life, fragile

When to Use Each

  • HASL: DIY projects, through-hole heavy boards, cost-sensitive
  • Lead-Free HASL: Same as HASL but RoHS required
  • ENIG: Fine-pitch ICs, BGAs, professional products
  • OSP: Quick assembly, cost-sensitive, single reflow

Free ENIG for 6-Layer Boards

JLCPCB currently offers free ENIG (2u” gold thickness) on 6-layer boards as a promotional offer.

Solder Mask & Colors

Solder mask protects copper traces and prevents solder bridges during assembly.

Available Colors

GreenFastest
Blue
Red
BlackMatte
White
Purple
Yellow

Solder Mask Parameters

  • Thickness: 16-30 micrometers (typical)
  • Min solder mask dam: 0.1mm between pads
  • Solder mask expansion: 0.05mm per side (typical)

Green = Fastest Turnaround

Green solder mask is optimized for fastest production. Choose green for quickest delivery when color doesn't matter.

Silkscreen Specifications

Silkscreen (legend) is used for component designators, polarity marks, and labels.

Silkscreen Parameters

ParameterStandardHigh-Precision
Min Line Width0.15mm (6 mil)0.1mm (4 mil)
Min Character Height1.0mm (40 mil)0.8mm (32 mil)
Width:Height Ratio1:6 (~17%)-
Hollow Font Gap>0.2mm-

Silkscreen Colors

  • White: Standard for most solder mask colors
  • Black: Available for white solder mask

Silkscreen Auto-Widening

JLCPCB may automatically widen silkscreen lines to 0.15mm if they're thinner. Complaints about unclear text from non-standard designs won't be accepted.

Impedance Control

JLCPCB offers impedance-controlled PCBs at no extra charge for multilayer boards.

Supported Impedance Types

TypeImpedance RangeUse Case
Microstrip (Single-ended)20-90ΩGeneral RF, GPIO
Coplanar (Single-ended)20-90ΩFlex PCBs, no ground plane
Edge-Coupled (Differential)50-150ΩUSB, HDMI, Ethernet
Dual Coplanar (Differential)50-150ΩHigh-speed differential

Using the Impedance Calculator

JLCPCB provides a free impedance calculator that:

  • Calculates required trace width for target impedance
  • Recommends compatible stackup configurations
  • Supports all four impedance types

Flex PCB Impedance Limitation

JLCPCB does NOT officially support impedance control for Flex PCBs. Material and thickness variations between batches can result in >10% impedance deviation.

Special Features

Advanced Capabilities

Castellated Holes

Half-holes on board edges for module mounting. Great for plug-in boards and RF modules.

Gold Fingers

Edge connector plating for card-edge connectors. Multiple gold thickness options.

Edge Plating

Copper plating on board edges for EMI shielding or grounding.

Press-Fit Holes

Precision holes for press-fit connectors without soldering.

Materials Available

  • FR-4: Standard fiberglass (most common)
  • Flex (Polyimide): Flexible circuits
  • Aluminum Core: LED applications, thermal
  • Copper Core: High thermal conductivity
  • Rogers: High-frequency RF applications
  • PTFE (Teflon): Low-loss RF

Not Supported

  • Blind/Buried Vias: Only through-holes supported
  • HDI Microvias: Not available in standard process
  • Rigid-Flex: Limited support (check availability)

Pre-Order Design Checklist

Before submitting your design to JLCPCB, verify these critical parameters:

JLCPCB DFM Checklist

Frequently Asked Questions

What happens if my design violates a design rule?

JLCPCB's automated system will flag violations. Minor issues may be accepted with a disclaimer. Major violations will require design changes. For borderline cases, contact support before ordering.

Can I use 3 mil trace/space on 4-layer boards?

3 mil is below the standard 4 mil minimum for 4-layer. It may be possible for very limited sections with extra fees. Contact JLCPCB support for feasibility.

Why can't I get blind/buried vias?

JLCPCB's standard production lines are optimized for through-hole vias only. Blind/buried vias require sequential lamination which significantly increases cost and time. For HDI needs, consider alternative manufacturers.

How accurate is the impedance control?

JLCPCB typically achieves +/-10% impedance tolerance for rigid PCBs. For tighter tolerances or specific requirements, request controlled impedance explicitly and specify your tolerance needs.

What's the fastest turnaround I can get?

Standard production is 3-5 days. Express options can achieve 24-48 hours for simple 2-layer designs. Multilayer and special processes take longer. Green solder mask has the fastest processing time.

Do I need fiducials for assembly?

No, JLCPCB adds fiducial marks automatically for SMT assembly if your design doesn't include them. However, including your own fiducials in optimal positions can improve placement accuracy.

Conclusion

Understanding JLCPCB's design rules is essential for successful, cost-effective PCB manufacturing. Key takeaways:

  1. Start with standard specs: 6 mil trace/space for 2-layer, 4 mil for 4-layer
  2. Use appropriate copper weight: 1oz is standard, 2oz for high current
  3. Choose the right finish: HASL for hobby, ENIG for fine-pitch
  4. Run DRC before ordering: Prevents rejection and delays
  5. Green is fastest: Choose green solder mask when color doesn't matter

Bookmark this guide and refer to it during your design process. When in doubt, choose more conservative specs - the extra margin improves yield and reliability.

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