Package Reference
| Imperial | Metric | Dimensions | Power | Component Type | Description | |
|---|---|---|---|---|---|---|
| 01005 | 0402M | 0.4 × 0.2 mm | 0.031W | ResistorsCapacitors | Smallest common SMD, requires specialized equipment | |
| 0201 | 0603M | 0.6 × 0.3 mm | 0.05W | ResistorsCapacitors | Very small, used in mobile devices | |
| 0402 | 1005M | 1 × 0.5 mm | 0.063W | ResistorsCapacitors | Common in compact designs, hand soldering difficult | |
| 0603 | 1608M | 1.6 × 0.8 mm | 0.1W | ResistorsCapacitors | Popular choice, smallest practical for hand soldering | |
| 0805 | 2012M | 2 × 1.25 mm | 0.125W | ResistorsCapacitors | Very common, easy to hand solder | |
| 1206 | 3216M | 3.2 × 1.6 mm | 0.25W | ResistorsCapacitors | Standard size, good for prototyping | |
| 1210 | 3225M | 3.2 × 2.5 mm | 0.5W | ResistorsCapacitors | Higher power and capacitance values | |
| 1812 | 4532M | 4.5 × 3.2 mm | 0.75W | ResistorsCapacitors | Large chip, high power applications | |
| 2010 | 5025M | 5 × 2.5 mm | 0.75W | Resistors | High power resistors | |
| 2512 | 6332M | 6.3 × 3.2 mm | 1W | Resistors | High power, current sense resistors | |
| 0402 | 1005M | 1 × 0.5 mm | — | Inductors | Chip inductor, low inductance values | |
| 0603 | 1608M | 1.6 × 0.8 mm | — | Inductors | Small chip inductor | |
| 0805 | 2012M | 2 × 1.25 mm | — | Inductors | Common chip inductor size | |
| 1008 | 2520M | 2.5 × 2 mm | — | Inductors | Medium power inductor | |
| 1210 | 3225M | 3.2 × 2.5 mm | — | Inductors | Higher current inductors | |
| SOD-323 | SC-76 | 1.7 × 1.25 mm | — | Diodes | Small signal diodes | |
| SOD-123 | SC-59 | 2.7 × 1.6 mm | — | Diodes | Common small diode package | |
| SOD-128 | — | 5 × 2.6 mm | — | Diodes | Medium power diodes | |
| SMA | DO-214AC | 4.3 × 2.6 mm | — | Diodes | 1A rectifier diodes | |
| SMB | DO-214AA | 4.6 × 3.6 mm | — | Diodes | 2A rectifier diodes | |
| SMC | DO-214AB | 7.1 × 6.2 mm | — | Diodes | 3-5A power diodes | |
| SOT-23 | SC-59 | 2.9 × 1.3 mm | — | Transistors | Very common 3-pin transistor package | |
| SOT-23-5 | SC-74A | 2.9 × 1.6 mm | — | TransistorsICs | 5-pin small ICs and transistors | |
| SOT-23-6 | SC-74 | 2.9 × 1.6 mm | — | TransistorsICs | 6-pin small ICs | |
| SOT-223 | — | 6.5 × 3.5 mm | — | Transistors | Medium power with heatsink tab | |
| SOT-89 | SC-62 | 4.5 × 2.5 mm | — | Transistors | Medium power transistors | |
| DPAK | TO-252 | 6.5 × 6.1 mm | — | Transistors | Power MOSFETs and regulators | |
| D2PAK | TO-263 | 10 × 8.9 mm | — | Transistors | High power MOSFETs | |
| SOIC-8 | SOP-8 | 4.9 × 3.9 mm | — | ICs | 8-pin small outline IC, 1.27mm pitch | |
| SOIC-14 | SOP-14 | 8.65 × 3.9 mm | — | ICs | 14-pin small outline IC | |
| SOIC-16 | SOP-16 | 9.9 × 3.9 mm | — | ICs | 16-pin small outline IC | |
| TSSOP-8 | — | 3 × 4.4 mm | — | ICs | Thin shrink SOP, 0.65mm pitch | |
| TSSOP-14 | — | 5 × 4.4 mm | — | ICs | Thin shrink 14-pin | |
| TSSOP-16 | — | 5 × 4.4 mm | — | ICs | Thin shrink 16-pin | |
| MSOP-8 | — | 3 × 3 mm | — | ICs | Mini SOP, 0.65mm pitch | |
| QFN-16 | — | 4 × 4 mm | — | ICs | Quad flat no-lead 16-pin | |
| QFN-32 | — | 5 × 5 mm | — | ICs | Quad flat no-lead 32-pin | |
| LQFP-32 | — | 7 × 7 mm | — | ICs | Low-profile QFP 32-pin | |
| LQFP-48 | — | 7 × 7 mm | — | ICs | Low-profile QFP 48-pin | |
| LQFP-64 | — | 10 × 10 mm | — | ICs | Low-profile QFP 64-pin |
Select packages from the table to compare sizes visually
Understanding SMD Package Sizes
Surface Mount Device (SMD) components come in standardized package sizes. Understanding these sizes is crucial for PCB design, component selection, and hand soldering feasibility.
Package names typically use two naming conventions:
- Imperial (EIA) — Dimensions in hundredths of an inch (e.g., 0805 = 0.08" × 0.05")
- Metric — Dimensions in tenths of a millimeter (e.g., 2012M = 2.0mm × 1.2mm)
Chip Resistors and Capacitors
The most common SMD components are chip resistors and capacitors. They share the same package sizes, making it easy to standardize your designs.
Common Sizes from Smallest to Largest
| Imperial | Metric | Size (mm) | Power (R) | Hand Solder |
|---|---|---|---|---|
| 01005 | 0402M | 0.4 × 0.2 | 0.031W | No |
| 0201 | 0603M | 0.6 × 0.3 | 0.05W | No |
| 0402 | 1005M | 1.0 × 0.5 | 0.063W | Difficult |
| 0603 | 1608M | 1.6 × 0.8 | 0.1W | Possible |
| 0805 | 2012M | 2.0 × 1.25 | 0.125W | Yes |
| 1206 | 3216M | 3.2 × 1.6 | 0.25W | Easy |
Which Size Should I Use?
- 0402 — High-density designs, reflow only, not for prototyping
- 0603 — Compact designs, smallest practical for hand soldering with practice
- 0805 — Best balance of size and ease of use, recommended starting point
- 1206 — Easy to handle, good for prototypes and higher power needs
Transistor and Small IC Packages
SOT (Small Outline Transistor) Family
- SOT-23 — Most common 3-pin transistor package (2.9 × 1.3mm)
- SOT-23-5/6 — 5 or 6 pin variant for small ICs like voltage references
- SOT-89 — Higher power than SOT-23, with larger center pin for heat
- SOT-223 — Medium power with large tab for heatsinking
Power Packages
- DPAK (TO-252) — Common for medium power MOSFETs and regulators
- D2PAK (TO-263) — Higher power version of DPAK
- TO-220 — Through-hole but often used with SMD pads
IC Packages
Leaded Packages
- SOIC — Small Outline IC, 1.27mm pitch, easy to solder
- TSSOP — Thin Shrink SOP, 0.65mm pitch, more compact
- MSOP — Mini SOP, even smaller than TSSOP
- LQFP — Low-profile QFP with leads on all four sides
Leadless Packages
- QFN — Quad Flat No-lead, excellent thermal performance
- DFN — Dual Flat No-lead, smaller footprint
- BGA — Ball Grid Array, highest density but requires reflow
Pin Pitch Reference
| Pitch | Packages | Hand Solder |
|---|---|---|
| 1.27mm | SOIC, SO | Easy |
| 0.8mm | LQFP-32/48 | Moderate |
| 0.65mm | TSSOP, MSOP | Difficult |
| 0.5mm | LQFP-64+, QFN | Very Difficult |
| 0.4mm | Fine-pitch QFP, BGA | Not Recommended |
Design Tips
For Prototyping
- Use 0805 or larger for passive components
- Choose SOIC over TSSOP/MSOP when available
- Avoid BGA and fine-pitch QFN for hand assembly
- Add test points and consider rework access
For Production
- 0402 is standard for modern pick-and-place
- QFN packages offer better thermal performance
- Match component sizes across the design when possible
- Consider availability and cost across package options
Thermal Considerations
- Larger packages dissipate more heat
- Exposed pads (QFN, DPAK) improve thermal transfer
- Use thermal vias under power components
- Check power ratings at your operating temperature
Frequently Asked Questions
Why are there two naming systems?
The imperial system (0805, 0603) originated in the US and uses dimensions in hundredths of an inch. The metric system uses millimeters. Both refer to the same physical packages. Always verify which system a datasheet uses to avoid confusion.
What is the smallest size I can hand solder?
With practice and proper tools (fine tip, flux, magnification), 0603 is achievable. 0805 is more comfortable for most hobbyists. 0402 is possible but requires significant skill and patience. Smaller sizes require professional equipment.
Why would I use smaller components?
Smaller components allow denser PCB layouts, shorter signal paths, reduced parasitic inductance and capacitance, and lower costs for high-volume production. Mobile devices routinely use 0201 and 01005 components.
Are larger packages being phased out?
No. While 0402 is increasingly common, 0805 and 1206 remain widely available and useful. Larger packages are preferred for prototyping, higher power applications, and designs where hand rework may be needed.